Ligand · 35N
35N · Copper(II) tetrapyrrole
35N, Copper(II) tetrapyrrole (C16 H16 Cu N4, 327.9 g/mol), in the MolNFT structures on GenesisL1: bound in 2 records (1 PDB entry). Every binding site with its residues within 4.5 Å, the residues it binds most and the ligands found with it.
- Component
- 35N
- Formula
- C16 H16 Cu N4
- Class
- ligand
- Structures
- 2
- PDB entries
- 1
Binding sites
35N in 2 structures; the first of them:
Found with
- NO3 · Nitrate ion
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